Technical Specifications

• Power Source: AC 220V±10％, 50/60 Hz
• Top Heater Power: 1000 W
• BTM Heater Power: 1200 W
• BTM Preheating power：3200 W
• Preheating Temperature.：350℃（Max）
• Preheating Temperature: 400℃（Max）
• V-type slot PCB positioning
• Laser assisted positioning
• Equipped with universal fixture
• Multi-function movable fixed bracket
• Support PCB Size: Max 415×370mm  Min 20*20mm
• IR Preheating Area: 380mm×280mm
• Adaptive Chip：BGA, QFN, CSP, POP, QFP, Micro SMD, LED patch lamp bead…
• Support IC Size: Max 60×60mm   Min 0.6×0.6mm
• Minimum Pitch Applicable:   0.15mm - Min
• Dimensions: L640×W850×H950 mm
• Display system: 15”HD industrial LCD
• Operation Mode: 7”HD touch screen
• Vacuum adsorption: Automatic
• Support Chip weight: 90g
• Alignment Accuracy: ±0.01mm
• Temperature Control: K-thermocouple closed loop control, accuracy up to ±1℃
• Machine weight:  about 86kg
• Appearance Color: white
• This machine is suitable for 0.6*0.6mm ICs and micro LED components rework

Package Includes